Characterisation of CMOS Sensors for the Belle II Vertex Detector Upgrade
by Marike Schwickardi
Date of Examination:2024-06-11
Date of issue:2024-07-12
Advisor:Prof. Dr. Ariane Frey
Referee:Prof. Dr. Ariane Frey
Referee:PD Dr. Jörn Große-Knetter
Files in this item
Name:thesis-Eversion.pdf
Size:15.2Mb
Format:PDF
Abstract
English
The Belle II experiment at KEK in Japan plans to upgrade the SuperKEKB accelerator by the end of the decade. This gives rise to the opportunity to upgrade the current vertex detector system to address the high background levels caused by the increased luminosity of the collider. One proposal for upgrading the vertex detector is to install a 5-layer all monolithic pixel vertex detector based on fully depleted CMOS DMAPS chips. The new system plans to use the OBELIX chips to improve background robustness and reduce occupancy levels through small and fast pixels. This causes better track finding, especially for low transverse momenta tracks. The OBELIX sensor is slated for submission in the summer of 2024, while its predecessor, the TJ-Monopix2, is undergoing testing. Since the TJ-Monopix2 serves as the baseline for the OBELIX and the matrix design will be carried over, a thorough characterisation and performance study is imperative. The thesis presents a comprehensive study of the TJ-Monopix2. Laboratory and electron beam tests were conducted on five modules with various front-end designs and substrate types, including irradiated modules. Four front-end designs were tested. Two are AC-coupled, and two are DC-coupled, while each design was separated into CASCODE and non-CASCODE designs. Despite encountering tuning difficulties with one module post-irradiation, all tuneable modules and front-end designs demonstrated stable operation at thresholds around 300 e−. AC-coupled front-end designs exhibited lower noise levels, potentially impacting threshold dispersion post-irradiation. Test beam measurements revealed stable operation of all TJ-Monopix2 modules. Depletion depth studies indicated similar depths for all flavours under different biases, but AC-coupled designs showed a significant signal loss, leading to reduced efficiency. Despite lacking calibrated cluster signal results for irradiated sensors, TJ-Monopix2 configurations met performance requirements for the Belle II upgrade, excelling in spatial resolution below 10 µm and efficiencies above 97%. Suggestions for maintaining both DC and AC-coupled pixels in the OBELIX design are proposed, pending further studies on irradiated modules. Looking ahead, progress continues on the OBELIX design, aligning with preparations for the conceptual design report for the VTX Belle II upgrade by the end of the decade.
Keywords: Belle II-Experiment; Belle II; SuperKEKB; Vertex Detector; CMOS DMAPS; OBELIX Chip; TJ-Monopix2; VTX Belle II Upgrade